Automated hbm memory die stacking advanced packaging 4k60p
A precision robot places the fifth HBM memory die onto a four-layer stack before an optical inspection camera verifies alignment inside a semiconductor cleanroom. Realistic footage for high bandwidth memory, AI chips and advanced packaging.
- Código
- 56238002
- Tipo
- CG動画素材
- Duração
- 00:10
- Aspeto
- 16:9
- Taxa de quadros
- 60
- Licença
- Sem direitos autorais